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Full Automatic WDS BGA 850 Optical Alignment For Chip Welding And Disassembly

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Full Automatic WDS BGA 850 Optical Alignment For Chip Welding And Disassembly

Brand Name : WDS

Model Number : WDS-850

Certification : CE

Place of Origin : China

MOQ : 1 UNIT

Payment Terms : T/T, Western Union, MoneyGram

Supply Ability : 150 UNITS PER MONTH

Delivery Time : 8-15 working days

Packaging Details : Wooden case

characteristic : X/Y automatically controlled

function : automatic feeding device

Total power supply : 8400W

power supply : 220V, 50/60Hz

weight : 200KG

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WDS-850 Optical alignment automatic repair equipment

Specification

Model WDS-850
Total power supply 8400W
Upper heating power supply 1600W
Lower heating power supply 1600W
IR heating power supply 5000W(2000W controlled)
Power supply 220V, 50/60Hz
Maximum 680*550mm
Minimum 10*10mm
Temperature measuring interfaces 5pcs
Chip zoom in and zoom out 2-50/times
The PCB thickness 0.5~8mm
Apply chip size 0.8*0.8~120*120mm
Applicable minimum chip spacing 0.15mm
Maximum mouting load 300g
Mounting precision ±0.01mm
Machine dimension L970*W700*H830mm
Machine weight 200KG

Excellent performance features

  1. Multi-language menu interface
  2. Automatic feeding decive
  3. X/Y axis can be controlled by rocker, fast oeration
  4. Imported high-definition CCD(2 million pixels) optical alignment ststem
  5. High precision temperature control system, accurate temperature control system, accuate temperature control

HD optical alignment and intelligent control

The integrated design of hot air head and mounting head has the functions of automatic mounting, automatic welding and automatic disassembly. High precision K-type thermocouple (KSENSOR) cLOSED Loop control, up and down independent temperature measurement, temperature control accuracy up to ± 1 degree, Over-temperature protection alarm function, software encryption and anti-stay function.

HD display

High-definition imported CCD(2 million pixels) digital imaging, automatic optical zoom system, automatic precision alignment control system with laser red dot, using 15 inch high-definition industrial display screen dispaly.

Vacuum adsorption and preheating platform

The upper heating head is equipped with a vacuum suction pipe for chip adsorption. The bottom preheating platform adopts imported excellent heating materials(infrared gold-plated light tube)+anti-flash thermostatic glass (temperature resistance up to 1800°C). The preheating area is up to 500*420mm. The preheating platform, splint device and cooling system can be moved as a whole in the X direction. Make PCB positioning and folding welding more safe and convenient.



Product Tags:

Full Automatic WDS BGA

      

Chip Disassembly WDS BGA

      

Chip Welding Automatic BGA Reballing Machine

      
Wholesale Full Automatic WDS BGA 850 Optical Alignment For Chip Welding And Disassembly from china suppliers

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